Application of Ultrasonic Bonding in Leds and Led Lamps Production

Authors K.N. Afonin, Y.V. Ryapolova, V.S. Soldatkin, V.I. Tuev

Tomsk State University of Control Systems and Radio Electronics, 40, Lenin Ave., Tomsk, Russia

Issue Volume 7, Year 2015, Number 4
Dates Received 28 September 2015; published online 10 December 2015
Citation K.N. Afonin, Y.V. Ryapolova, V.S. Soldatkin, V.I. Tuev, J. Nano- Electron. Phys. 7 No 4, 04029 (2015)
PACS Number(s) 85.30.De
Keywords Nitride chip, Current-voltage characteristic of the LED, Ultrasonic microwelding, Planning eksperiment.
Annotation This article presents the results of studies of the effect ultrasonic bonding on the current-voltage characteristic nitrides chips with using methods of planning the experiment.

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