Application of Ultrasonic Bonding in Leds and Led Lamps Production
| Authors | K.N. Afonin, Y.V. Ryapolova, V.S. Soldatkin, V.I. Tuev |
| Affiliations | Tomsk State University of Control Systems and Radio Electronics, 40, Lenin Ave., Tomsk, Russia |
| Е-mail | |
| Issue | Volume 7, Year 2015, Number 4 |
| Dates | Received 28 September 2015; published online 10 December 2015 |
| Citation | K.N. Afonin, Y.V. Ryapolova, V.S. Soldatkin, V.I. Tuev, J. Nano- Electron. Phys. 7 No 4, 04029 (2015) |
| DOI | |
| PACS Number(s) | 85.30.De |
| Keywords | Nitride chip, Current-voltage characteristic of the LED, Ultrasonic microwelding, Planning eksperiment. |
| Annotation | This article presents the results of studies of the effect ultrasonic bonding on the current-voltage characteristic nitrides chips with using methods of planning the experiment. |
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List of References |
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