Тhermoresistive Properties of the Thin Film Solid Solutions Based on Cu and Ni

Authors S.M. Kalinichenko, О.P. Tkach, T.M. Hrychanovska, L.V. Odnodvorets

Sumy State University, 2, R.-Korsakov St., 40007 Sumy, Ukraine

Issue Volume 7, Year 2015, Number 4
Dates Received 26 October 2015; published online 10 December 2015
Citation S.M. Kalinichenko, О.P. Tkach, T.M. Hrychanovska, L.V. Odnodvorets, J. Nano- Electron. Phys. 7 No 4, 04048 (2015)
PACS Number(s) 81.40.Wx
Keywords Solid solution (6) , Concentration of magnetic component atoms, Temperature coefficient of resistance.
Annotation The phase composition and properties of thermoresistive thin film solid solutions (s.s.) based on Cu and Ni obtained by condensation of layered metal followed by annealing in the temperature range of 300-800 K were investigated. It was concluded that the relatively small value of the thermal coefficient of resistance (≈ 10 – 4 K – 1) related to the essential role of an additional mechanism of scattering on particular crystalline structure and on Ni atoms are dissolved in the Cu matrix. It was established that in the investigated ranges of thicknesses, concentrations of Ni atoms and temperatures the bcc s.s. (Cu, Ni) has physical properties (electrical resistance, temperature coefficient of resistance, range on the temperature) which meet the requirements for industrial low-thermistors.

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