Structure, Strength and Conductive Properties of Vacuum Cu-Ta Condensates CuTa
| Authors | M.A. Zhadko, A.I. Zubkov, O.V. Sobol’ , A.V. Subbotin, E.V. Zozulya, G.I. Zelenskaya |
| Affiliations |
National Technical University "Kharkiv Polytechnic Institute", 2, Kyrpychov Str., 61002 Kharkіv, Ukraine |
| Е-mail | maglushchenko@gmail.com |
| Issue | Volume 10, Year 2018, Number 3 |
| Dates | Received 30 March 2018; published online 25 June 2018 |
| Citation | M.A. Zhadko, A.I. Zubkov, O.V. Sobol’, et al., J. Nano- Electron. Phys. 10 No 3, 03003 (2018) |
| DOI | https://doi.org/10.21272/jnep.10(3).03003 |
| PACS Number(s) | 68.37.Lp, 81.07.Bc, 81.15.Ef. |
| Keywords | Grain size (4) , Grain boundary segregation, Strength (6) , Hardness (12) , Conductivity.CuTa . |
| Annotation |
Structure, strength and electrical conductivity of Cu-Ta vacuum condensates with a tantalum concentration from 0.1 to 3 at % is studied. Depending on the content of tantalum, the condensates have different structural states: one- and two-phase, supersaturated tantalum solution in FCC copper lattice. Alloying of copper condensates with tantalum reduces the grain size from ~ 3 m to ~ 50 nm. The optimum ratio of strength properties and electrical conductivity is realized at a tantalum content of ~ 0.4 – 0.5 at. %. In this case, the ultimate tensile strength reaches ~ 1000 MPa with an electrical conductivity of ~ 50 % of the single-component copper. It is shown that the main contribution to the increase in strength is made by grain boundary strengthening due to the decrease in the grain size and the increase in the Hall-Petch constant. |
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List of References |
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