Теmperature Coefficient of Resistance of Nanoscale Materials for Flexible Electronic
| Authors | I.P. Buryk , D.I. Tolstikov , L.V. Odnodvorets |
| Affiliations |
Sumy State University, 40007 Sumy, Ukraine |
| Е-mail | l.odnodvorets@aph.sumdu.edu.ua |
| Issue | Volume 17, Year 2025, Number 2 |
| Dates | Received 05 February 2025; revised manuscript received 18 April 2025; published online 28 April 2025 |
| Citation | I.P. Buryk, D.I. Tolstikov, L.V. Odnodvorets, J. Nano- Electron. Phys. 17 No 2, 02031 (2025) |
| DOI | https://doi.org/10.21272/jnep.17(2).02031 |
| PACS Number(s) | 60.68.Bs, 72.10.Fk, 73.63.Bd |
| Keywords | Nanoscale materials for affordable energy-efficient electronics, Рhase formation processes, Тemperature coefficient of resistance (TCR), High thermal stability, Low sensitivity to deformation. |
| Annotation |
The results of experimental studies of the temperature dependence of the resistance and the temperature coefficient of resistance (TCR) for nanoscale two-component film alloys based on Fe, Pd or Pt, Mo and Ni atoms are present. These materials have low sensitivity to deformation (strain coefficient 1.8-2.2 units) in the range of deformations up to 10 %, which makes them promising materials for sensor and flexible electronics. It was established that the properties of the films are affected by the processes of structural ordering under the influence of temperature, as well as surface and grain boundary electron scattering. It is shown that the TCR of film materials depends on the phase composition of the films and when the total thickness of the system changes from 10 to 80 nm in the temperature range of 300-850 K, it is (2.0-9.5)·10 – 4 К – 1 (phases FePd, FePt, FePd3, FePt3) and (8.0-9.8)·10 – 4 К – 1 (Ni3Mo). The TCR measurement results confirm the high temperature stability of these systems. |
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List of References |
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