Exploring Thermal Characteristics of Functionally Graded Nanomaterials for Enhanced Heat Dissipation in Electronic Devices

Authors N.B.V. Lakshmi Kumari1, Anne Jagadish2, Ishart M. Mirzana3, Jogi Krishna4, Atul Bhattad2, Nageswara Rao Medikondu2
Affiliations

1Research Scholar, Department of Mechanical Engineering, Koneru Lakshmaiah Education FoundationVaddeswaram, Guntur, 522302, India

2Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Vaddeswaram, Guntur, 522302, India

3Department of Mechanical Engineering, Muffakham Jah College of Engineering and Technology,Hyderabad, Telangana 500034, India

4Department of Mechanical Engineering, Rise Krishna Sai Prakasam Group of Institutions, Valluru, Ongole, Andhra Pradesh, 523272, India

Е-mail medikondu1979@gmail.com
Issue Volume 16, Year 2024, Number 3
Dates Received 15 April 2024; revised manuscript received 22 June 2024; published online 28 June 2024
Citation N.B.V. Lakshmi Kumari, Anne Jagadish, Ishart M. Mirzana, и др., J. Nano- Electron. Phys. 16 No 3, 03021 (2024)
DOI https://doi.org/10.21272/jnep.16(3).03021
PACS Number(s) 44.25. + f, 44.27. + g
Keywords Electronic systems, Functionally Graded Materials, Heat Sink, Thermal performance, CPU.
Annotation

With the advancements in electronic systems, efficient cooling has become an exciting task in thermal grounds. For optimum working conditions of electronic systems energy-efficient a heat sink is used. In the present paper, thermal simulation is carried out on two different profiles of existing heat sinks used in the processor. Six different cases were studied and compared namely natural and forced convection on circular and rectangular heat sinks with and without FGM (Functionally Graded Materials.) Conventional material aluminium alloy 6061 and functionally graded material AlSi10Mg are used to understand the variation of temperature of the heat sink by applying the necessary boundary conditions for the heat sink profile. The energy model and finite volume method have been used for investigation using ANSYS software. In comparison between the two heat sink profiles, it is witnessed that the circular heat sink dissipates more heat. From the thermal analysis, it is found that using FGM will improve the heat transfer rate, and the temperature variation is found to be 3oC in comparison with conventional material because FGM is inhomogeneous materials consisting of two or more materials.

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