Study of the Optimal Composition of the Bath on Nucleation and Growth of Ni-Fe Alloy Thin Films

Authors F. Lekmine1,2 , I. Zidani3 , A. Chala1,2 , A. Gana2

1University of Abbes Laghrour Khenchela

2Physic Laboratory of Thin Films and Applications, University of Biskra, Algeria

3University Hadj Lakhdar, Batna 1, Algeria

Issue Volume 14, Year 2022, Number 6
Dates Received 28 October 2022; revised manuscript received 20 December 2022; published online 27 December 2022
Citation F. Lekmine, I. Zidani, A. Chala, A. Gana, J. Nano- Electron. Phys. 14 No 6, 06022 (2022)
PACS Number(s) 81.15.Pq ,, 68.55.Ln, 68.55.Nq, 64.60.qj
Keywords Bath composition, Potential (54) , Cyclic voltammetry (2) , Chronoamperometry, Ni-Fe alloy thin films, Nucleation, Growth (10) , Germination.

Ni-Fe alloy thin films are one of the oldest topics within the framework of electrochemistry because they exhibit a range of physical properties that lead to their widespread use in a variety of applications. In this study, the effects of bath composition and applied potential on Ni-Fe alloy thin films were investigated. Ni-Fe thin films were electrodeposited on copper substrates at a pH of approximately 3, and the experiments were performed at room temperature. The deposition time was equal to 10 min for all deposited samples and the applied potential (– 1.35 V, 1 V) and bath composition (0.0.05, 0.075 and 0.1 M). The experiments were performed using electrochemical techniques such as cyclic voltammetry (CV), and an electrochemical method called chronoamperometry was used to develop electrolytic alloys of the Ni-Fe type by considering the nucleation growth phenomenon. We demonstrated in fact, the concentration of the electrolyte had almost no effect on the type of nucleation, but its effect appeared in the linearity of the curve. The diffusion coefficient and nucleation density for instantaneous nucleation and the nucleation rate for progressive nucleation were also evaluated and the Ni-Fe thin film deposition reaction showed nucleation and growth (3D) under diffusion control. Germination of Ni-Fe is difficult on copper substrate surfaces for low overpotentials, and the maximum time decreases with increasing overpotentials.

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