Transient 3D Thermomechanical Simulation of the Frictional Contact of the Pin-on-Disc System

Authors A. Abboudi1,2, S. Boulahrouz1,3, K. Mansouri1

1Department of Mechanical Engineering, Abbes Laghrour University, 40000 Khenchela, Algeria

2I.S.M.A. Laboratory, Abbes Laghrour University, 40000 Khenchela, Algeria

3Electromechanical Engineering Laboratory, 23000 Annaba, Algeria

Issue Volume 14, Year 2022, Number 4
Dates Received 31 May 2022; revised manuscript received 10 August 2022; published online 25 August 2022
Citation A. Abboudi, S. Boulahrouz, et al., J. Nano- Electron. Phys. 14 No 4, 04006 (2022)
PACS Number(s) 62.20.Qp, 68.60.Dv
Keywords Pin-on-disc, Friction (3) , Thermomechanics, Numerical simulation (3) , COMSOL (4) .

Friction generates thermal dissipation accompanied by heating of the pin-on-disc system, in some cases this heating can affect the thermomechanical properties of the system. In this paper, transient 3D numerical simulation by the COMSOL multiphysics software of the thermomechanical behavior during the dynamic contact of the pin-on-disc system is presented. A thermomechanical model of friction is adopted from the literature. The effects of contact delay [0..10] second, pin load variation [1..4] MPa and disc speed variation [10..15] m/s are discussed. The results of the present paper show that an increase in the contact delay generates a rapid increase in the temperature of the contact area in the first seconds, starting from the fourth second, the increase is very small and becomes constant due to the propagation of heat by conduction in the free areas of the pin-on-disc system. The effect of a gradual increase in pin load is more remarkable than that of disc speed on the thermomechanical behavior of the pin-on-disc system.

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