Instantaneous Fabrication of Thin MEMS Features by Copper Electrodeposition Using Modified Inkjet Printer

Authors Vimal Kumar Deshmukh1, Ankit Namdev1, H.K. Narang1, M.S. Rajput1, P.M. Pandey2
Affiliations

1Department of Mechanical Engineering, National Institute of Technology, Raipur, 492010 Chhattisgarh, India

2Department of Mechanical Engineering, Indian Institute of Technology, 110016 Delhi, India

Е-mail deshmukh.vimal1920@gmail.com
Issue Volume 12, Year 2020, Number 2
Dates Received 18 February 2020; revised manuscript received 11 April 2020; published online 25 April 2020
Citation Vimal Kumar Deshmukh, Ankit Namdev, H.K. Narang, et al., J. Nano- Electron. Phys. 12 No 2, 02044 (2020)
DOI https://doi.org/10.21272/jnep.12(2).02044
PACS Number(s) 07.10.Cm, 81.15.Pq
Keywords MEMS (7) , Electrodeposition (6) , Copper (8) , Inkjet, Thin Metallic Coating.
Annotation

Microelectromechanical system (MEMS) has been used so far in today’s scenario in mechatronic assemblies to enhance its functionality and mitigate the complexity of design. Micro electrodeposition technique enables to produce such features. This research is an attempt to fabricate the micro feature instantaneously using a modified ink jet printer on an aluminium substrate. The acidic electrolyte was prepared by using Cupric Sulphate Penta hydrate (CuSO4.5H2O) of 1M concentration with H2SO4. Multiple passes deposit the copper ion on Aluminium sheet with thickness of 0.2 mm. the feature design, Voltage and concentration of electrolyte has been taken as Input parameter. Surface characteristics have been discussed in this article. Result revealed thin metallic sheet can only be used for 6-7 passes due to wrinkles and edge deformation. If more passes will be carried out on an aluminium foil sheet then uniform deposition of copper metal ions will be possible. The concentration of CuSO4.5H2O has played important role in this experimental process on deposition rate.

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