Review of MEMS Test Structures for Mechanical Parameter Extraction
| Автори | A. Sharma1, M. Kaur1, D. Bansal1, D. Kumar2 , K. Rangra1 |
| Приналежність | 1 Central Electronics Engineering Research Institute/Council of Scientific & Industrial Research (CEERI/CSIR), Sensors and Nanotechnology Group, Pilani 333031, Rajasthan, India 2 Department of Electronics Sciences, Kurukshetra University, Kurukshetra 136119, Haryana, India |
| Е-mail | kjrangra@gmail.com, akshdeepsharma@gmail.com, dineshelectronics@gmail.com |
| Випуск | Том 3, Рік 2011, Номер 1, Part 2 |
| Дати | Received 04 February 2011, in final form 03 May 2011, published online 08 May 2011 |
| Посилання | A. Sharma, M. Kaur, D. Bansal, et al., J. Nano- Electron. Phys. 3 No1, 243 (2011) |
| DOI | |
| PACS Number(s) | 85.85. – j, 62.40. – i |
| Ключові слова | Mems test structures, Residual stress, Stress gradient, Young’s modulus (3) , Poisson ratio, Pull-in voltage. |
| Анотація |
This paper reviews the recent progress in MEMS test structures for mechanical parameter extraction. MEMS test structures reviewed include cantilevers, fixed-fixed beams, bent-beam, guckel rings, pointers, circular diaphragm, and lancet structures. Important mechanical and process parameters are highlighted, as they have significant contributions to the performance of MEMS devices. The challenges and statues of the test structures are outlined and discussed. |
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