Size-Dependent Physical Properties of Metallic Films: Analysis of Thermal and Mechanical Characteristics in the Nanoscale Regime
| Authors | S.R. Thorat1, V.M. Tidake2, P.M. Patare1, P.B. Khatkale3, A.A. Khatri4, P.M. Yawalkar5, S.S. Ingle1 |
| Affiliations |
1Department of Mechanical Engineering, Sanjivani College Engineering, Kopargaon, SPPU, Pune, India 2Department of MBA, Sanjivani College of Engineering, Kopargaon, SPPU, Pune, India 3Sanjivani University, Kopargaon, MH, India 4Department of Computer Engineering, Jaihind College of Engineering, Kuran, SPPU, Pune, MH, India 5Department of Computer Engineering, MET's Institute of Engineering, Nashi, India |
| Е-mail | thoratsandipmech@sanjivani.org.in |
| Issue | Volume 16, Year 2024, Number 3 |
| Dates | Received 16 April 2024; revised manuscript received 20 June 2024; published online 28 June 2024 |
| Citation | S.R. Thorat, V.M. Tidake, et al., J. Nano- Electron. Phys. 16 No 3, 03014 (2024) |
| DOI | https://doi.org/10.21272/jnep.16(3).03014 |
| PACS Number(s) | 73.22. – f, 81.07.Bc |
| Keywords | Metallic films, Thermal characteristics, Mechanical characteristics (2) , Nanoscale materials. |
| Annotation |
Metallic films, which are thin layers of metal deposited on surfaces, have a wide range of uses in many sectors. Metallic films are usually produced by sputtering or chemical vapor deposition and serve an important role in electronics, optics and coatings. Their fundamental conductivity, reflective qualities and adaptability makes important for the development of innovative materials and systems. Investigations are conducted on the rigidity, optical reflecting power, temperature conductivity and power mobility of metallic films. These attributes are affected by layer thickness, composition and deposition processes. Understanding the complexities of these physical features is critical for modifying metallic films to particular applications, which drives technological and material science innovation. In this research, the physical characteristics of metallic films, which are thinner than 20 – 200 nm were evaluated. The suggested methods for determining the Cu, and Al films temperature-dependent coefficients of resistance, thermal conductivity properties, particular heat and thermal diffusivity. The rapid amount of heating that is observed in a brief period allows the thermal characteristics of the metallic layer to be primarily evaluated without impacting the substrate. |
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List of References |
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