Electrical Conductivity and Magnetoresistive Properties of Film Alloys Based on Permalloy Fe0.5Ni0.5 and Copper
| Authors | O.V. Bezdidko , Yu.O. Shkurdoda , I.O. Shpetnyi |
| Affiliations |
Sumy State University, 2, Rymsky-Korsakov St., 40007 Sumy, Ukraine |
| Е-mail | yu.shkurdoda@gmail.com |
| Issue | Volume 12, Year 2020, Number 3 |
| Dates | Received 03 April 2020; revised manuscript received 15 June 2020; published online 25 June 2020 |
| Citation | O.V. Bezdidko, Yu.O. Shkurdoda, I.O. Shpetnyi, J. Nano- Electron. Phys. 12 No 3, 03034 (2020) |
| DOI | https://doi.org/10.21272/jnep.12(3).03034 |
| PACS Number(s) | 73.61.At, 72.15.Gd |
| Keywords | High-entropy alloys, Solid solutions (2) , Anisotropic magnetoresistance, Resistivity (11) , Electrical conductivity (10) . |
| Annotation |
The paper shows the experimental results of the study of magnetoresistive properties and electrical conductivity of medium-entropy alloys based on permalloy Fe0.5Ni0.5 and Cu with a copper concentration from 5 to 50 % obtained by the technique of simultaneous deposition in vacuum. It is shown that the phase composition of both recently deposited and thermostabilized at a temperature of 700 K film alloys with a thickness d = 20-100 nm corresponds to the FCC phase of s.s. FeNi(Cu) with the lattice parameter a = 0.360-0.361 nm. After annealing the samples at a temperature of 700 K, an increase in the size of the crystallites to 50 nm is observed. For all samples, the anisotropic nature of the field dependences of the magnetoresistance with an amplitude value of 0.02-0.3 % depending on the thickness and Cu content is observed. With increasing concentration of copper, the value of the longitudinal and transverse magnetoresistance decreases. Annealing of film alloys leads to an increase in the value of the anisotropic magnetoresistance by 1.5-3 times. Reducing the measurement temperature to 120 K increases the value of the magnetoresistance by 1.3-1.5 times. For films with d = 20-30 nm and copper content of 5-30 %, the resistivity is (40-55)·10 – 7 Ohm⋅m, and for films with dF = 40-70 nm and copper content of 40-50 % – (10-20)·10 – 7 Ohm⋅m. Annealing of the samples at a temperature of 700 K leads to an irreversible decrease in resistivity by 1.5-2 times depending on the thickness and Cu content. Typical metal temperature dependences of resistivity are observed for all thermostabilized samples. |
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