Grain-Boundary Diffusion in Cu and Ni Films With Thin Metal Coating

Authors T.P. Hovorun , S.I. Protsenko , V.A. Pchelintsev, A.M. Chornous
Affiliations Sumy State University, 2, Rimsky-Korsakov Str., 40007, Sumy, Ukraine
Е-mail [email protected]
Issue Volume 1, Year 2009, Number 4
Dates Received 24.11.2009, in final form 02.12.2009
Citation T.P. Hovorun, S.I. Protsenko, V.A. Pchelintsev, A.M. Chornous, J. Nano- Electron. Phys. 1 No4, 90 (2009)
PACS Number(s) 68.60. – р, 68.35.Fx, 68.60.Dv
Keywords Grain-boundary diffusion, Diffusion processes, Grain boundary, Thin coating, Average grain size.
Investigation results of the grain-boundary diffusion in Сu films with thin Ni coating and in Ni films with thin Cu coating by the low-temperature resistometric method are presented in this work. It is shown that during the coating deposition and thermal annealing the irreversible increase in the electrical resistance by the value from tenth parts to a few Ohms is observed. This is caused by the diffusion processes of coating atoms on the grain boundaries of base layers.

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