Effects of Copper Doping and Annealing Temperature on the Structural, Morphological and Optical Properties of NiO Thin Films

Authors A. Haichour , N. Hamdadou
Affiliations

Laboratoire de Micro et de Nanophysique (LaMiN), Ecole Nationale Polytechnique d’Oran Maurice AUDIN (ENPO-MA), BP1523 El-Mnaouer, Oran 31000, Algérie

Е-mail haichour_amel@hotmail.fr
Issue Volume 11, Year 2019, Number 6
Dates Received 09 September 2019; revised manuscript received 04 December 2019; published online 13 December 2019
Citation A. Haichour, N. Hamdadou, J. Nano- Electron. Phys. 11 No 6, 06020 (2019)
DOI https://doi.org/10.21272/jnep.11(6).06020
PACS Number(s) 61.05.− a, 78.20.− e
Keywords Thin films (60) , NiO (20) , Spray pyrolysis (9) , GIXRD (3) , AFM (18) , Optical properties.NiClHO.
Annotation

The aim of this work is to study the influence of copper doping and annealing temperature treatment on structural, morphological and optical properties of nickel oxide (NiO) thin films. Cu doped NiO thin films were deposited on glass substrates at 350 °C by spray pyrolysis technique. Nickel chloride hexahydrate NiCl26H2O, deionized water and copper were used as precursor, solvent and dopant source respectively after annealing at different temperatures of 400, 450, 500 and 550 °C. The grazing incidence X-ray diffraction (GIXRD) patterns revealed that NiO:Cu films are polycrystalline with face centered cubic structure and preferred orientation direction along [200] corresponding to 2 value of approximately 43°. Atomic force microscopy (AFM) visualization revealed that surface morphology was found to be influenced by incorporation of Cu and average roughness increases from 5.17 nm to 99.03 nm when the doping rate varied from 2 % to 6 %. The optical transmittance decreases from 85 % to 65 % with the increase in Cu doping concentrations of NiO films annealed at 550 °C and the optical band gap was blue-shifted from 3.63 eV to 3.82 eV.

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