Laser Scribing Optimization of RF Magnetron Sputtered Molybdenum Thin Films

Author(s) V.B. Padhiar1, A.L. Patel2, J.R. Ray1 , M.S. Desai1 , C.J. Panchal1
Affiliations

1 Department of Applied Physics, M.S. University of Baroda, Vadodara – 390001, Gujarat India

2 Director, Sahjanand Laser Technology Ltd., E-30, G. I.D.C. Electronics Estate, Sector 26, Ghandhinagar-382 028, Gujarat, India

Е-mail cjpanchal_msu@yahoo.com, arvindp@sahajanandlaser.com
Issue Volume 3, Year 2011, Number 1, Part 1
Dates Received 04 February 2011, published online 22 March 2011
Citation V.B. Padhiar, A.L. Patel, J.R. Ray, et al., J. Nano- Electron. Phys. 3 No1, 9 (2011)
DOI
PACS Number(s) 42.62.Cf, 73.61.At
Key words Laser scribing, Molybdenum thin film (2) , Laser power, Pulse frequency, Scribe line width.
Annotation
The optimization process of laser scribing of back contacts is carried out by varying different parameters of laser and thickness of Molybdenum (Mo) thin-films. Mo thin films were deposited by RF magnetron sputtering on the organically cleaned soda lime glass substrate. The thickness of Mo was in the range of 60 nm to 800 nm. For the scribing process the laser power and the laser pulse frequency were varied. Different thickness of Mo shows the different scribe behavior. The optimized process provides a successful isolative laser scribing, having a minimum scribe line width, of Mo layer on glass substrate without any presence of walls, ridges, or collars in scribed areas.

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